Our long-term distribution in Japan NIHON friction solder, antifriction tin / tin rods, reducing Moxi Si / antifriction solder wire, solder paste and other lead-free solder antifriction materials: * To protect the global environment, the Japanese company has developed antifriction a series of lead-free solder products. Lead-free solder solder than the average family products more reliable, more stable, greatly improving production capacity. * Integrated years of research results from the (mirror effect), can help to reduce the formation of oxidized residues, improve solder flow, allowing for better engagement splitting capabilities; * After 5 hours of use, the mirror effect of the lead-free solder produced by oxidation residue content, only regular unleaded solder 1/4; * antifriction company committed to the development of lead-free solder technology, in order to get a reasonable price customers quality products and speedy, reliable service. Product Name melting point metal components tensile strength elongation wetting time NP302 Sn-0.3Ag-0.7Cu 216-227 25 40 2.02 NP303 Sn-3.0Ag-0.5Cu 217-221 37 33 1.58 NP503 Sn-0.7Cu 227 28 34 2.30 Solder Bar (additional use): Append rods contain copper solder used to suppress the increase in the copper content in the furnace. Product Name metal components NP302T Sn-0.3Ag NP303T Sn-3.0Ag