Our long-term distribution in Japan NIHON friction solder, antifriction tin / tin rods, reducing Moxi Si / antifriction solder wire, solder paste and other lead-free solder antifriction material: NP303: Sn96.5-3Ag-0.5Cu (NP303 ) is a representation of lead-free solder composition. Japan alone with antifriction processing technology to reduce the amount of oxide production, significantly improved the solder flow. Products List EG-1 NP303 JIS A type of rosin core wire. The inhibition of the surface tension of the solder, to achieve a landmark high welding rod tip separation type. YS-RMA NP303 RMA rosin core wire type. Incipient wetness significantly improved products. A low-temperature can be dissolved instantaneously, it is possible for high-speed, smooth operation. Also suitable for automatic welding. DHB-RMA3 NP303 RMA rosin core wire type. Soldering flux and solder balls flying greatly improved. YS-RMA NP521 welding rod tip is to eat to prevent type. You can extend the life of welding rods.